Wet Cleaning + ECD

ASNA compounds for wet cleaning are highly engineered for static, dynamic, and bonded applications that require minimal metallic ion contamination.

Thermal Applications

ASNA compounds are proven to have excellent thermal stability and maintain integrity at elevated temperatures often found in processes such as Oxidation, Diffusion, Annealing, and RTP.

Thin Film + Dry Etch

 

Thin Film, such as HDPCVD, PECVD, SACVD, PVD and ALD, along with Dry Etch and Ashing processes present harsh plasma and gas environments, often at elevated temperatures. Where traditional seals might break down in these conditions, ASNA next-generation compounds have excellent chemical and thermal resistance and are virtually impervious to extreme fabrication processes.

LIFETIME

Designed for optimal lifetime

PERFORMANCE

Excellent performance in high temperature applications

RESISTANCE

Excellent plasma resistance

SEALING LOADS

Withstands higher sealing loads

OUTSTANDING

Outstanding physical properties

PURITY

Ultra-high purity

High Performance O-rings

 

ASNA has a great deal of experience manufacturing a full range of standard O-ring sizes, AS-568A, JIS series, and Metric sizes. Our in-house tool makers have extensive experience fabricating high precision standard and custom molds to meet the most demanding applications with a short response time.
ASNA’s highly integrated design and manufacturing processes are dedicated to provide our customers with standard products or custom made-to-order seals and rubber components to the highest quality standards.

Copyright © 2018 Applied Seals NA, Inc.  All rights reserved.  

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